JPH0222410U - - Google Patents
Info
- Publication number
- JPH0222410U JPH0222410U JP10085788U JP10085788U JPH0222410U JP H0222410 U JPH0222410 U JP H0222410U JP 10085788 U JP10085788 U JP 10085788U JP 10085788 U JP10085788 U JP 10085788U JP H0222410 U JPH0222410 U JP H0222410U
- Authority
- JP
- Japan
- Prior art keywords
- nut
- protruding teeth
- treatment film
- surface treatment
- peeling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004381 surface treatment Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 2
Landscapes
- Details Of Indoor Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10085788U JPH0222410U (en]) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10085788U JPH0222410U (en]) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0222410U true JPH0222410U (en]) | 1990-02-14 |
Family
ID=31329315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10085788U Pending JPH0222410U (en]) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0222410U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459213U (en]) * | 1990-09-27 | 1992-05-21 | ||
| JP2020148298A (ja) * | 2019-03-14 | 2020-09-17 | 株式会社東芝 | 締結部材及び半導体装置 |
-
1988
- 1988-07-29 JP JP10085788U patent/JPH0222410U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0459213U (en]) * | 1990-09-27 | 1992-05-21 | ||
| JP2020148298A (ja) * | 2019-03-14 | 2020-09-17 | 株式会社東芝 | 締結部材及び半導体装置 |